Microfabrication Capabilities

Design

  • Sensors: piezoresistive, piezoelectric, capacitive, resonant
  • Actuators: electrostatic, thermal bimorph, piezoelectric, magnetic
  • Microcantilevers, with or without tips
  • Microfluidics
  • Micromolds
  • Silex SilVia® Through Silicon Via

Process

  • Mask design and layout in .TDB or .GDS format
  • Contact lithography to 2 um and stepper lithography to 0.35 um
  • All bulk and surface micromachining processes for silicon, glass, and quartz, on 100 or 150 mm diameter substrates up to 10 mm thick (non-standard substrate shapes on a case-by-case basis)
  • CMOS-compatible processes
  • MEMS over pre-fab CMOS
  • Polymer micromachining using SU-8 and PDMS
  • Less common thin film materials, such as AlN, ZnO, Pt, and others
  • Limited capabilities for sapphire, III-V semiconductors, and other substrates

Back-end

  • Wafer bonding: anodic, polymer, eutectic
  • Grind and polish
  • Laser coring and drilling
  • Dicing, traditional and stealth
  • Wirebonding, die attach, underfill, globbing
  • Chip to Flex circuit

Other processes

  • Traditional metal machining
  • Plastics embossing
  • Rapid prototyping stereolithography
  • Chemical milling of sheet metal